The POU3500 system presents dynamic temperature Charge of the method chamber cathode / electrode / anode and can be synchronized with any etch process.
thirty% of its peak power consumption, presenting our clients significant reduction in operating prices and enhanced reliability.
the knowledge down below is categorized by semiconductor process and Resource company. Each table consists of an programs Matrix that shows qulified and commercial processes.
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This outstanding method, supplying a little type aspect, cheap-of-Ownership and Dynamic Temperature Management supplied approach and products engineers a whole new Software to optimize their temperature sensitive procedures.
The accuracy with the POU 3300 permits unbiased control of the process fluid temperature to the wafer chuck inside +/- 0.1 °C of established issue, as well as the rapid reaction time with the process enables for max wafer-to-wafer repeatability all over the etch system.
All static TCUs demand extra cooling & heating capacities due to their quite big process fluid reservoirs. the procedure fuid reservoir on LAUDA-Noah's dynamic temperature Management program is a lot less than one gallon.
While using the POU3300, you may attain unparalleled brings about etch performance, chamber uptime, diminished price of ownership and fab space utilization – all even though improving upon your approach trustworthiness.
the info pertains into a 300mm chamber temperature profile during a substantial aspect ratio Etch process, working at quite high RF electrical power problems (~three.8kW). The compelling areas of this information established are:
Dynamic Temperature Command, as implemented in units such as LAUDA-Noah POU, is surely an method that senses the temperature of the method fluid coming back from the procedure chamber’s wafer chuck (ESC) and dynamically adjusts the temperature of the provided process fluid depending on this serious-time suggestions.
The TEs' can swap directly from heating to cooling, or visa-versa. they're able to activate & off although inside the heating or cooling mode and may increase or reduce the amount of heating or cooling with out switching in anyway.
much more than at any time, shrinking gadget geometries, demanding new processes in addition to a highly competitive surroundings need temperature Manage devices that combine fast and correct temperature Handle using an emphasis on diminished operating expenses and enhanced dependability.
the fact is usually that accurate Dynamic Temperature Handle can only be attained when all 5 (5) of the following technique design and style and installation prerequisites are fulfilled:
(for that reason, installing a static unit close to chamber Noohapou will never help it to deliver dynamic temperature Handle)
We need a lot less cooling/heating capability for the same application as a static TCU on account of our modest reservoir volume.